Final Thoughts on Chemistry for Cuprous thiocyanate

Balanced chemical reaction does not necessarily reveal either the individual elementary reactions by which a reaction occurs or its rate law.Application of 1111-67-7. In my other articles, you can also check out more blogs about 1111-67-7

Application of 1111-67-7, A catalyst don’t appear in the overall stoichiometry of the reaction it catalyzes, but it must appear in at least one of the elementary reactions in the mechanism for the catalyzed reaction. 1111-67-7, Name is Cuprous thiocyanate, molecular formula is CCuNS. In a Article£¬once mentioned of 1111-67-7

Deep Ultraviolet Copper(I) Thiocyanate (CuSCN) Photodetectors Based on Coplanar Nanogap Electrodes Fabricated via Adhesion Lithography

Adhesion lithography (a-Lith) is a versatile fabrication technique used to produce asymmetric coplanar electrodes separated by a <15 nm nanogap. Here, we use a-Lith to fabricate deep ultraviolet (DUV) photodetectors by combining coplanar asymmetric nanogap electrode architectures (Au/Al) with solution-processable wide-band-gap (3.5-3.9 eV) p-type semiconductor copper(I) thiocyanate (CuSCN). Because of the device's unique architecture, the detectors exhibit high responsivity (?79 A W-1) and photosensitivity (?720) when illuminated with a DUV-range (peak = 280 nm) light-emitting diode at 220 muW cm-2. Interestingly, the photosensitivity of the photodetectors remains fairly high (?7) even at illuminating intensities down to 0.2 muW cm-2. The scalability of the a-Lith process combined with the unique properties of CuSCN paves the way to new forms of inexpensive, yet high-performance, photodetectors that can be manufactured on arbitrary substrate materials including plastic. Balanced chemical reaction does not necessarily reveal either the individual elementary reactions by which a reaction occurs or its rate law.Application of 1111-67-7. In my other articles, you can also check out more blogs about 1111-67-7

Reference£º
Copper catalysis in organic synthesis – NCBI,
Special Issue “Fundamentals and Applications of Copper-Based Catalysts”